14 Layer ENIG FR4 E Patoa Ka PCB
Mabapi le Lifofu Tse Patoang ka PCB
Blind vias le vias patoa ke litsela tse peli ho theha dikgokelo pakeng tsa le dikarolo hatisitsoeng boto oa potoloho.The vias foufetseng ea hatisitsoeng oa potoloho boto ke ka koporo-plated vias hore ka amahanngoa le lera ka ntle ka boholo ba lera ka hare.Mokotjana o kopanya likarolo tse peli kapa ho feta tse ka hare empa ha o kenelle lera le ka ntle.Sebelisa li-microblind vias ho eketsa sekhahla sa kabo ea mohala, ho ntlafatsa maqhubu a seea-le-moea le tšitiso ea motlakase, ho tsamaisa mocheso, ho sebelisoa ho li-server, mehala ea cellular, lik'hamera tsa dijithale.
E patoa ka PCB
The patoa Vias amahanya le dikarolo tse peli kapa ho feta ka hare empa ha e phunyeletse lera ka ntle
Min Hole Diameter/mm | Min ring/mm | via-in-pad Diameter/mm | Maximum Diameter/mm | Aspect ratio | |
Litsela tsa Bofofu(tse tloaelehileng) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
Blind Vias(sehlahisoa se khethehileng) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Sefofu Ka PCB
Blind Vias ke ho hokahanya lera le ka ntle bonyane lera le le leng le ka hare
| Min.Hole Diameter/mm | Bonyane selikalikoe/mm | via-in-pad Diameter/mm | Maximum Diameter/mm | Aspect ratio |
Blind Vias(ho cheka mochini) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
Lifofu ka Vias(Ho cheka ka laser) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Monyetla oa Vias ea foufetseng le ho patoa Vias bakeng sa baenjiniere ke ho eketseha ha karolo segokanyipalo ntle le ho eketseha lera palo le boholo ba boto oa potoloho.Bakeng sa lihlahisoa tsa elektroniki tse nang le sebaka se moqotetsane le mamello e nyane ea moralo, moralo oa lesoba le foufetseng ke khetho e ntle.Tšebeliso ea masoba a joalo e thusa moenjiniere oa moralo oa potoloho ho rala karo-karolelano e loketseng ea lesoba / pad ho qoba likarohano tse feteletseng.