4 Layer ENIG FR4 Half Hole PCB
Mokhoa o Tloaelehileng oa Metallized Half-Hole PCB Fabrication process
Drilling -- Chemical Copper -- Full Plate Copper -- Image Transfer -- Graphics Electroplating -- Defilm -- Etching -- Stretch Soldering -- Half Hole Surface Coating (Shaped at the Same Time with the Profile).
Sekoti se entsoeng ka metallized se khaola ka halofo ka mor'a hore ho thehoe lesoba le chitja.Ho bonolo ho hlaha ketsahalo ea masala a koporo terata le letlalo la koporo warping ka lesoba halofo, e leng ama mosebetsi oa lesoba halofo le lebisa ho fokotseha ha tshebetso ya sehlahisoa le chai.E le ho hlola mefokolo e kaholimo, e tla etsoa ho latela mehato e latelang ea metallized semi-orifice PCB:
1. Ho sebetsa halofo ea lesoba habeli mofuta oa V thipa.
2. Ka ho cheka ha bobeli, sekoti sa tataiso se kenngoa moeling oa sekoti, letlalo la koporo le tlosoa esale pele, 'me burr e fokotsehile.Li-grooves li sebelisetsoa ho cheka ho ntlafatsa lebelo la ho oa.
3. Copper plating holim'a substrate, e le hore lera la koporo plating leboteng lesoba lesoba le chitja moeling oa poleiti.
4. Potoloho e ka ntle e entsoe ka filimi ea compression, ho pepeseha le nts'etsopele ea substrate ka lehlakoreng le leng, ebe substrate e kenngoa ka koporo le thini ka makhetlo a mabeli, e le hore lera la koporo le leboteng la lesoba la lesoba le pota-potileng moeling oa sekoti. poleiti e teteaneng 'me lesela la koporo le koahetsoe ke lesela la thini le nang le phello e khahlanong le kutu;
5. Half lesoba ho etsa poleiti bohale chitja lesoba sehiloeng ka halofo ho etsa halofo lesoba;
6. Ho tlosa filimi ho tla tlosa filimi e khahlanong le ho pata e hatelitsoeng ka mokhoa oa ho hatisa filimi;
7. Eketsa substrate, 'me u tlose lesela le pepesitsoeng la koporo karolong e ka ntle ea substrate ka mor'a ho tlosa filimi;Tin peeling The substrate e eboloa e le hore thini e tlosoe leboteng le nang le semi-perforated le lesela la koporo holim'a semi- lebota le nang le dibono le pepesitsoe.
8. Ka mor'a ho bopa, sebelisa tepi e khubelu ho khomarela lipoleiti tsa yuniti hammoho, le holim'a alkaline etching line ho tlosa li-burrs.
9. Ka mor'a ho roala ha koporo ea bobeli le tin plating holim'a substrate, sekoti se chitja se moeling oa poleiti se khaoloa ka halofo ho etsa lesoba la halofo.Hobane lera la koporo la lerako la sekoti le koahetsoe ke lesela la thini, 'me lera la koporo la lerako la sekoti le kopantsoe ka ho feletseng le lera la koporo la karolo e ka ntle ea substrate,' me matla a tlamang a maholo, lesela la koporo holim'a sekoti. lebota le ka qojoa ka katleho ha seha, joalo ka ho hula kapa ketsahalo ea ho roala ha koporo;
10. Ka mor'a ho phethoa ha semi-sekoti eaba o tlosa filimi, 'me joale etch, koporo holim'a oxidation ke ke etsahala, ka katleho qoba ho etsahala ha masala a koporo esita le ketsahalo e khutšoanyane oa potoloho, ntlafatsa kotulo ea metallized seka-lesoba PCB. .