4 Layer ENIG RO4003 + AD255 Mixed Lamination PCB
RO4003C Rogers High Frequency PCB Materials
Thepa ea RO4003C e ka tlosoa ka borashe bo tloaelehileng ba nylon.Ha ho na ho tšoara e khethehileng e hlokahalang pele electroplating koporo ntle le motlakase.Letlapa le tlameha ho phekoloa ka mokhoa o tloaelehileng oa epoxy / khalase.Ka kakaretso, ha ho hlokahale ho tlosa borehole hobane tsamaiso e phahameng ea TG resin (280 ° C+[536°F]) ha e fetohe mmala habonolo nakong ea ho cheka.Haeba letheba le bakoa ke ts'ebetso e matla ea ho phunya, resin e ka tlosoa ho sebelisoa potoloho ea plasma e tloaelehileng ea CF4 / O2 kapa ka ts'ebetso e habeli ea alkaline permanganate.
Sebaka sa thepa sa RO4003C se ka 'na sa etsoa ka mochine le / kapa lik'hemik'hale bakeng sa tšireletso e khanyang.Ho khothalletsoa ho sebelisa li-photoresists tse tloaelehileng tsa aqueous kapa semi-aqueous.Wiper leha e le efe ea koporo e fumanehang khoebong e ka sebelisoa.Li-mask tsohle tse hloekisitsoeng kapa tse rekisoang ka lifoto tse atisang ho sebelisoa bakeng sa epoxy/glass laminates li khomarela hantle holim'a ro4003C.Ho hloekisa ka mochini oa libaka tse pepesitsoeng tsa dielectric pele ho ts'ebeliso ea limaske tse cheselletsang le libaka tse "ngolisitsoeng" tse "ngolisitsoeng" li tla qoba ho khomarela hantle.
Litlhoko tsa ho pheha tsa thepa ea ro4000 li lekana le tsa epoxy / khalase.Ka kakaretso, lisebelisoa tse sa pheheng lipoleiti tsa epoxy / khalase ha li hloke ho pheha lipoleiti tsa ro4003.Bakeng sa ho kenya khalase ea epoxy / e besitsoeng e le karolo ea mokhoa o tloaelehileng, re khothalletsa ho pheha ka 300 ° F, 250 ° f (121 ° c-149 ° C) bakeng sa lihora tse 1 ho isa ho tse peli.Ro4003C ha e na se thibelang malakabe.Ho ka utloisisoa hore poleiti e kentsoeng ka yuniti ea infrared (IR) kapa e sebetsang ka lebelo le tlase haholo la phetisetso e ka fihlela mocheso o fetang 700 ° F (371 ° C);Ro4003C e ka qala ho tuka ka mocheso ona o phahameng.Litsamaiso tse ntseng li sebelisa lisebelisoa tsa infrared reflux kapa lisebelisoa tse ling tse ka fihlelang mocheso ona o phahameng li lokela ho nka mehato e hlokahalang ho netefatsa hore ha ho na kotsi.
Li-laminate tsa maqhubu a phahameng li ka bolokoa ka nako e sa lekanyetsoang mocheso oa kamore (55-85 ° F, 13-30 ° C), mongobo.Ka mocheso oa kamore, lisebelisoa tsa dielectric ha li na mongobo o phahameng.Leha ho le joalo, liaparo tsa tšepe tse kang koporo li ka oxidize ha li pepesehetse mongobo o phahameng.Standard pele ho hloekisa ea PCBS ka habonolo tlosa kutu ho tloha thepa e bolokoang hantle.
Thepa ea RO4003C e ka etsoa ka lisebelisoa tse sebelisoang ka tloaelo bakeng sa maemo a epoxy / khalase le tšepe e thata.Foil ea koporo e tlameha ho tlosoa mocheng oa tataiso ho thibela ho tlotsa.
Lisebelisoa tsa Rogers RO4350B/RO4003C
| Thepa | RO4003C | RO4350B | Tataiso | Yuniti | Boemo | Mokhoa oa Teko |
| Dk(ε) | 3.38±0.05 | 3.48±0.05 | - | 10GHz/23℃ | IPC.TM.6502.5.5.5Clamp microstrip line teko | |
| Dk(ε) | 3.55 | 3.66 | Z | - | 8 ho isa ho 40 GHz | Mokhoa o fapaneng oa bolelele ba mohato |
| Sekhahla sa tahlehelo(tan δ) | 0.00270.0021 | 0.00370.0031 | - | 10GHz/23℃2.5GHz/23℃ | IPC.TM.6502.5.5.5 | |
| Coefficient ea mocheso oadielectric kamehla | +40 | +50 | Z | ppm/℃ | 50 ℃ ho 150 ℃ | IPC.TM.6502.5.5.5 |
| Ho Hanyetsa Molumo | 1.7X100 | 1.2X1010 | MΩ.cm | COND A | IPC.TM.6502.5.17.1 | |
| Bokaholimo ba Resistance | 4.2X100 | 5.7X109 | MΩ | 0.51 limilimithara(0.0200) | IPC.TM.6502.5.17.1 | |
| Mamello ea Motlakase | 31.2(780) | 31.2(780) | Z | KV/mm(V/mil) | RT | IPC.TM.6502.5.6.2 |
| Tensile modulus | 19650 (2850)19450 (2821) | 16767 (2432)14153 (2053) | XY | MPa(kpsi) | RT | ASTM D638 |
| Matla a tšepe | 139 (20.2)100 (14.5) | 203 (29.5)130 (18.9) | XY | MPa(kpsi) | ASTM D638 | |
| Matla a Kobehang | 276(40) | 255(37) | MPa(kpsi) | IPC.TM.6502.4.4 | ||
| Botsitso ba Dimensional | ＜0.3 | ＜0.5 | X,Y | mm/m(mils/inch) | Ka mor'a ho senya+E2/150℃ | IPC.TM.6502.4.39A |
| CTE | 111446 | 101232 | XYZ | ppm/℃ | 55 ho isa ho 288 ℃ | IPC.TM.6502.4.41 |
| Tg | 280 | 280 | ℃ DSC | A | IPC.TM.6502.4.24 | |
| Td | 425 | 390 | ℃ TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.71 | 0.69 | W/m/K | 80 ℃ | ASTM C518 | |
| Sekhahla sa Mongobo | 0.06 | 0.06 | % | 0.060" lisampole li ile tsa qoelisoa ka metsing ka mocheso oa 50 ° C ka lihora tse 48 | ASTM D570 | |
| Botenya | 1.79 | 1.86 | gm/cm3 | 23 ℃ | ASTM D792 | |
| Matla a Peel | 1.05(6.0) | 0.88(5.0) | N/mm(pli) | 1 oz.EDC ka mor'a ho soeufala ha tin | IPC.TM.6502.4.8 | |
| Lelakabe Retadancy | N/A | V0 | UL94 | |||
| Lf Kalafo e Tsamaellana | Ee | Ee |
Kopo ea RO4003C High Frequency PCB
Lihlahisoa tsa puisano tsa mehala
Power Splitter, coupler, duplexer, filter le lisebelisoa tse ling tse sa sebetseng
Amplifier ea Matla, Sehlaseli sa Lerata le tlase, joalo-joalo
Sistimi e khahlanong le ho thulana ha likoloi, sistimi ea sathelaete, sistimi ea seea-le-moea le likarolo tse ling
Pontšo ea Lisebelisoa
PCB Automatic Plating Line
PCB PTH line
PCB LDI
