Molemo ka ho fetisisa 4 Layer ENIG SF302 + FR4 Rigid-Flex PCB Moetsi le Fektheri |Lipotoloho tsa Huihe

4 Layer ENIG SF302 + FR4 Rigid-Flex PCB

Tlhaloso e Khutšoanyane:

Lera: 4
Ts'ebetso e Khethehileng: Rigid-Flex Board
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: SF302+FR4
Outer Track W/S: 5/5mil
Pina e ka Hare W/S: 6/6mil
Botenya ba Boto: 1.0mm
Min.Bophara ba lesoba: 0.3mm

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Lintlha tsa Tlhokomelo Moralong oa Rigid Flexible Combination Zone

1.Mohala o lokela ho fetoha hantle, 'me tataiso ea mola e lokela ho ba perpendicular ho tataiso ea ho khumama.

2.Mokhanni o tla ajoa ka ho lekana ho pholletsa le sebaka se kobehang.

3.Bophara ba conductor bo tla eketsoa ho pholletsa le sebaka se kobehang.

Moralo oa 4.PTH ha oa lokela ho sebelisoa sebakeng se thata sa phetoho se feto-fetohang.

5.Ho kobeha radius ea libaka tse kobehang tsa PCB e thata e tenyetsehang

Lintho tse bonahalang tsa flexible PCB

Motho e mong le e mong o tloaelane le lisebelisoa tse Rigid, 'me mefuta ea FR4 ea thepa e sebelisoa hangata.Leha ho le joalo, litlhokahalo tse ngata li hloka ho tsotelloa bakeng sa lisebelisoa tse thata tse tenyetsehang tsa PCB.Ho hlokahala hore a loketse bakeng sa adhesion, molemo mocheso ho hanyetsa, e le ho etsa bonnete ba hore ka thata flexural bonding karolo ea tekanyo e tšoanang ea katoloso ka mor'a futhumatsang ntle le deformation.Baetsi ba kakaretso ba sebelisa letoto la resin ea thepa e thata ea PCB.

Bakeng sa lisebelisoa tse feto-fetohang, khetha substrate 'me u koahele filimi e nang le katoloso e nyane le ho fokotseha.Ka kakaretso sebelisa lisebelisoa tse thata tsa tlhahiso ea PI, empa hape le ts'ebeliso e tobileng ea substrate e sa khomarelang bakeng sa tlhahiso.Lisebelisoa tsa flex ke tse latelang:

Lintho tsa motheo: FCCL(Flexible Copper Clad Laminate)

PI.Polymide: Kapton (12.5 um / 20 um / 25 um / 50 um / 75um).Ho feto-fetoha ha maemo hantle, ho hanyetsa mocheso o phahameng (mocheso oa nako e telele oa tšebeliso ke 260 ° C, nako e khutšoanyane ea 400 ° C), ho kenngoa ha mongobo o phahameng, litšobotsi tse ntle tsa motlakase le tsa mechine, ho thibela ho lla hamonate.Ho hanyetsa boemo ba leholimo bo botle, khanyetso ea lik'hemik'hale le ho lieha ha lelakabe.Polyester imide (PI) ke eona e sebelisoang ka ho fetisisa.PET.Polyester (25 um / 50 um / 75um).Theko e tlaase, e ntle ea ho tenyetseha le ho hanyetsa meokho.Lintho tse ntle tsa mochini le tsa motlakase tse kang matla a ho tsitsa, ho hanyetsa metsi hantle le hygroscopicity.Empa ka mor'a ho futhumala, tekanyo ea ho fokotseha e kholo 'me mocheso o phahameng oa ho hanyetsa o fokola.Ha e loketse mocheso o phahameng oa soldering, ntlha ea ho qhibiliha ea 250 ° C, e fokolang e sebelisoang

Ho koahela Membrane

Karolo e ka sehloohong ea filimi e koahelang ke ho sireletsa potoloho, ho thibela potoloho ho tloha mongobo, tšilafalo le welding.The Conductive Layer e ka ba Rolled Annealed Copper, Electrodeposited Copper le Silver Ink.Sebopeho sa kristale ea koporo ea electrolytic e boima, e sa lokelang ho hlahisa lihlahisoa tse ntle.Mohaho oa kristale oa koporo oa calender o boreleli, empa ho khomarela filimi ea motheo ho fosahetse.E ka khetholloa ho tloha ponahalong ea letheba le foil ea koporo.Electrolytic koporo foil e khubelu ea koporo, foil ea koporo ea calendering e bosoeu bo bohlooho.Lisebelisoa tse Eketsehileng le Li-Stiffeners: Seo se hatelloa karolong ea flex PCB bakeng sa likarolo tsa welding kapa ho eketsa stiffeners bakeng sa ho kenya.Filimi e matlafatsang e fumaneha FR4, poleiti ea resin, sekhomaretsi se nang le khatello ea maikutlo, matlafatso ea pampiri ea tšepe ea aluminium, jj.

Sekhomaretsi se sa phalleng/Mocheso o tlase sekhomaretsi se phekotsoeng ka mokhoa o fokolang (Low Flow PP).Lihokelo tse thata le tse Flex li sebelisoa bakeng sa Rigid flex PCB, hangata PP e tšesaane haholo.

E fetileng: 8 Layer HASL FPC+FR4 Rigid-Flex PCB

E 'ngoe: 4 Layer FPC+FR4 Rigid Flex PCB

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