Molemo ka ho Fetisisa oa Layer 8 ENIG Blind E Patoa Ka Moetsi oa PCB le Feme |Lipotoloho tsa Huihe

8 Lera ENIG Sefofu se Epeloa Ka PCB

8 Layer ENIG Sefofu se Epeloa Ka PCB Featured Image

Tlhaloso e Khutšoanyane:

Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 3/3mil
Lera le ka hare W/S: 3/3mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.1mm
Tshebetso e kgethehileng: Blind & Buried Vias

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Mabapi le Level 1 HDI PCB

Theknoloji ea Level 1 ea HDI ea PCB e bua ka lesoba la laser foufetseng feela le amanang le lera le haufi le eona la bobeli la ho etsa lesoba la theknoloji.

ho tobetsa ka nako e le 'ngoe ka mor'a ho cheka → ka ntle hape u tobetsa foil ea koporo → ebe ho phunya laser

Mabapi le Level 1 HDI PCB

Boemo ba 2 HDI PCB

Theknoloji ea Level 2 HDI PCB ke ntlafatso ho thekenoloji ea Level 1 HDI PCB.E kenyelletsa mefuta e 'meli ea laser blind ka ho phunya ka ho toba ho tloha holim'a lera ho ea karolong ea boraro, le laser blind hole ho phunya ka ho toba ho tloha holim'a lera ho ea karolong ea bobeli ebe ho tloha karolong ea bobeli ho ea ho ea boraro.Bothata ba theknoloji ea Level 2 HDI PCB bo boholo ho feta tekhenoloji ea Level 1 HDI PCB.

Tobetsa ka nako e le 'ngoe ka mor'a ho cheka → ka ntle hape u tobetsa foil ea koporo → laser, ho phunya→ ka ntle hape u tobetsa foil ea koporo→ ho phunya ka laser

Likarolo tse 8 tsa habeli ka Level 1 HDI PCB

8 layers Of Habeli Via Level 1 HDI PCB

Palo e ka tlase ke 8 layers ea level 2 cross blind vias, mokhoa ona oa ts'ebetso le likarolo tse robeli tse kaholimo tsa lesoba la tatellano ea bobeli, le tsona li hloka ho bapala li-perforations tsa laser tse peli.Empa li-perforations ha li phuthetsoe ka holim'a tse ling ho etsa hore ho be thata haholo ho sebetsa.