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4 Layer ENIG FR4 Sefofu se Patoa Ka PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4 Tg170
Lera la Kantle W/S: 5.5/6mil
Lera le ka hare W/S: 17.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.5mm
Mokhoa o khethehileng: Blind Vias -
10 Layer ENIG FR4 Blind Vias PCB
Likarolo: 10
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
W/S: 4/4mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: Blind Vias -
6 Lera HASL Sefofu se Epeloa Ka PCB
Likarolo: 6
Qetello ea bokaholimo: HASL
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 9/4mil
Lera le ka hare W/S: 11/7mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.3mm -
8 Lera ENIG Sefofu se Epeloa Ka PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 3/3mil
Lera le ka hare W/S: 3/3mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.1mm
Tshebetso e kgethehileng: Blind & Buried Vias -
14 Layer ENIG FR4 E Patoa Ka PCB
Likarolo: 14
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/5mil
Lera le ka hare W/S: 4/3.5mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.2mm
Tshebetso e kgethehileng: Blind & Buried Vias -
4 Layer ENIG FR4 E Patoa Ka PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 6/4mil
Lera le ka hare W/S: 6/5mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.3mm
Ts'ebetso e khethehileng: Lifofu le Li patoa ka Vias, taolo ea impedance -
12 Layer ENIG FR4 Blind Vias PCB
Likarolo: 12
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 7/4mil
Lera le ka hare W/S: 5/4mil
Botenya: 1.5mm
Min.bophara ba lesoba: 0.25mm -
8 Layer ENIG FR4 E Patoa Ka PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4.5/3.5mil
Lera le ka hare W/S: 4.5/3.5mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.25mm
Ts'ebetso e khethehileng: Blind & Buried Vias, taolo ea impedance -
6 Layer ENIG FR4 Blind Vias PCB
Likarolo: 6
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
W/S: 5/4mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: Blind Vias
