Thepa ea puisano PCB
E le ho khutsufatsa sebaka sa phetisetso ea matšoao le ho fokotsa tahlehelo ea phetisetso ea matšoao, boto ea puisano ea 5G.
Mohato ka mohato ho ea ho lithapo tse matla haholo, sebaka se setle sa terata, to ile a nts'etsopele tataiso ea micro-aperture, mofuta o mosesaane le ho tšepahala ho phahameng.
Ntlafatso e tebileng ea theknoloji ea ts'ebetso le ts'ebetso ea tlhahiso ea lisinki le lipotoloho, ho feta litšitiso tsa tekheniki.Eba moetsi ea khabane oa boto ea PCB ea puisano e phahameng ea 5G.
Indasteri ea Lipuisano Le Lihlahisoa tsa PCB
| Indasteri ea puisano | Lisebelisoa tse ka sehloohong | Lihlahisoa tse hlokahalang tsa PCB | Karolo ea PCB |
| Marang-rang a se nang mohala | Seteishene sa motheo sa puisano | Boto e ka morao, boto ea li-multilayer e lebelo le phahameng, boto ea microwave e nang le maqhubu a mangata, karoloana ea tšepe e sebetsang ka bongata. | Metal base, boholo bo boholo, multilayer e phahameng, lisebelisoa tse phahameng tsa maqhubu le motlakase o tsoakiloeng |
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Marang-rang a phetiso | Thepa ea phetisetso ea OTN, sesebelisoa sa phetiso ea microwave e ka morao, boto ea multilayer e lebelo le holimo, boto ea microwave e phahameng haholo | Sefofane se ka morao, boto ea multilayer e lebelo le holimo, boto ea microwave e nang le maqhubu a phahameng haholo | Lintho tse nang le lebelo le phahameng, boholo bo boholo, li-multilayer tse phahameng, letsoalo le phahameng, mokokotlo oa mokokotlo, motsoako o thata-flex, lisebelisoa tse phahameng tsa maqhubu le khatello e tsoakiloeng. |
| Puisano ya data | Li-routers, li-switches, tšebeletso / polokelo Devic | Semela se ka morao, boto ea multilayer e lebelo le holimo | Lintho tse nang le lebelo le phahameng, boholo bo boholo, li-multi-layer tse phahameng, li-high density, mokokotlo oa mokokotlo, motsoako o thata-flex |
| Broadband e tsitsitseng ea marang-rang | OLT, ONU le lisebelisoa tse ling tsa fiber-to-the-hae | Lintho tse nang le lebelo le phahameng, boholo bo boholo, li-multi-layer tse phahameng, li-high density, mokokotlo oa mokokotlo, motsoako o thata-flex | Multilay |
PCB Of Communication Equipment And Mobile Terminal
Lisebelisoa tsa Puisano
Mobile Terminal
Tshebetso Mathata a High Frequency le High Speed PCB Board
| Ntlha e thata | Mathata |
| Ho nepahala ha ho tsamaisana | Ho nepahala ho thata haholoanyane, 'me ho hokahanya ha li-interlayer ho hloka ho kopana ha mamello.Mofuta ona oa ho kopana o thata haholoanyane ha boholo ba poleiti bo fetoha |
| STUB (Ho se tsoelepele ho sitisang) | STUB e thata haholoanyane, botenya ba poleiti bo thata haholo, 'me ho hlokahala theknoloji ea ho phunya ka morao |
| Ho nepahala ha impedance | Ho na le phephetso e kholo ho etching: 1. Lintho tse hlabang: tse nyenyane li molemo, ho mamella ho nepahala ha etching ho laoloa ke + /-1MIL bakeng sa lineweights tsa 10mil le ka tlase, le + /-10% bakeng sa ho mamellana ha linewidth ka holimo ho 10mil.2. Litlhoko tsa bophara ba mela, sebaka sa mela le botenya ba mola li phahame.3. Tse ling: sekhahla sa wiring, tšitiso ea interlayer ea pontšo |
| Keketseho e eketsehileng ea tahlehelo ea matšoao | Ho na le phephetso e kholo ea ho phekola holim'a li-laminate tsohle tsa koporo;ho hlokahala tolerances phahameng PCB botenya, ho akarelletsa le bolelele, bophara, botenya, verticality, seqha le khopameng, joalo-joalo. |
| Boholo bo ntse bo eketseha | The machinability e ba mpe le ho feta, ho tsamaisoa ho mpefala, 'me lesoba le foufetseng le hloka ho patoa.Theko ea eketseha2. Ho nepahala ha tlhophiso ho thata haholoanyane |
| Palo ea lihlopha e ba holimo | Litšobotsi tsa mela e teteaneng le ka tsela, boholo ba yuniti e kholo le lesela le tšesaane la dielectric, le litlhoko tse thata ho feta bakeng sa sebaka se ka hare, ho hokahanya ha interlayer, taolo ea impedance le ho ts'epahala. |
Boiphihlelo bo Bokeletseng ho Boto ea Phatlalatso ea Tlhahiso ea HUIHE Lipotoloho
Litlhoko tse phahameng tsa density:
Phello ea crosstalk (lerata) e tla fokotseha ka ho fokotseha ha melahare / sebaka.
Litlhoko tse thata tsa impedance:
Ho tsamaisana le litšobotsi ke tlhokahalo ea mantlha ea boto ea microwave e phahameng haholo.E kholoanyane ea ho itšireletsa, ke hore, bokhoni bo boholo ba ho thibela pontšo ho kena ka har'a lera la dielectric, ka potlako ho fetisa pontšo le tahlehelo e nyenyane.
Ho nepahala ha tlhahiso ea likhoele tsa phetiso hoa hlokahala hore e be holimo:
Ho fetisoa ha lets'oao la maqhubu a phahameng ho thata haholo bakeng sa ts'itiso ea terata e hatisitsoeng, ke hore, bonnete ba tlhahiso ea mohala oa phetisetso hangata o hloka hore moeli oa mohala oa phetiso o be makhethe haholo, o se ke oa burr, notch, kapa terata. ho tlatsa.
Litlhoko tsa mochini:
Pele ho tsohle, thepa ea boto ea microwave e phahameng-frequency e fapane haholo le lisebelisoa tsa lesela la khalase ea epoxy ea boto e hatisitsoeng;ea bobeli, ho nepahala ha machining ea boto ea microwave e phahameng-frequency e phahame haholo ho feta ea boto e hatisitsoeng, 'me mamello ea sebopeho se akaretsang ke ± 0.1mm (tabeng ea ho nepahala ho phahameng, mamello ea sebopeho ke ± 0.05mm).
Khatello e kopaneng:
Tšebeliso e tsoakiloeng ea "high-frequency substrate" (PTFE class) le "high-speed substrate" (PPE class) e etsa hore boto ea potoloho ea lebelo le phahameng e se ke ea e-ba le sebaka se seholo sa conduction feela, empa hape e na le litlhoko tse tsitsitseng tsa dielectric, tse phahameng tsa dielectric shielding. le ho hanyetsa mocheso o phahameng.Ka nako e ts'oanang, ts'ebetso e mpe ea delamination le khatello ea khatello e tsoakiloeng e bakoang ke phapang ea ho khomarela le coefficient ea ho atolosa mocheso pakeng tsa lipoleiti tse peli tse fapaneng li lokela ho rarolloa.
Ho hlokahala hore ho be le ho tšoana ho holimo ha coating:
Tšitiso ea tšobotsi ea mohala oa phetisetso ea boto ea microwave e phahameng e ama ka kotloloho boleng ba phetisetso ea lets'oao la microwave.Ho na le kamano e itseng pakeng tsa tšobotsi impedance le botenya ba foil koporo, haholo-holo bakeng sa poleiti microwave e nang le masoba metallized, botenya barbotage ha feela ama botenya kakaretso ea foil koporo, empa hape ama ho nepahala ha terata ka mor'a hore etching. .ka hona, boholo le ho tšoana ha botenya ba ho roala bo lokela ho laoloa ka thata.
Ts'ebetso ea laser micro-through hole:
Tšobotsi ea bohlokoa ea boto e phahameng haholo bakeng sa puisano ke micro-ka lesoba le foufetseng / patoa lesoba sebopeho (aperture ≤ 0.15mm).Hajoale, ts'ebetso ea laser ke mokhoa o ka sehloohong oa ho theha likoti tse nyane.Karo-karolelano ea bophara ba lesoba ho bophara ba poleiti e kopanyang e ka fapana ho tloha ho mofani ho ea ho mofani oa thepa.Karo-karolelano ea bophara ba lesoba ho poleiti e kopanyang e amana le ho nepahala ha boemo ba borehole, 'me ha lihlopha li le ngata, ho ka ba le ho kheloha ho hoholo.hajoale, hangata e amohetsoe ho latela sebaka seo ho shebiloeng ho sona ho latela lera.Bakeng sa lithapo tse phahameng haholo, ho na le li-disk tse sa kopaneng ka masoba.
Phekolo ea holim'a metsi e rarahane haholoanyane:
Ka ho eketseha ha makhetlo a mangata, khetho ea phekolo ea holim'a metsi e fetoha ea bohlokoa le ho feta, 'me ho roala ka motlakase o motle oa motlakase le ho roala ho tšesaane ho na le tšusumetso e fokolang ho pontšo."Bothata" ba terata bo tlameha ho lumellana le botenya ba phetisetso eo pontšo ea phetisetso e ka e amohelang, ho seng joalo ho bonolo ho hlahisa pontšo e tebileng "leqhubu le emeng" le "reflection" joalo-joalo.Inertia ea molek'hule ea li-substrates tse khethehileng tse kang PTFE e etsa hore ho be thata ho kopanya le foil ea koporo, kahoo ho hlokahala phekolo e khethehileng ea holim'a metsi ho eketsa boima ba holim'a metsi kapa ho eketsa filimi e khomarelang pakeng tsa foil ea koporo le PTFE ho ntlafatsa ho khomarela.
