computer-repair-london

Lisebelisoa tsa Puisano

Thepa ea puisano PCB

E le ho khutsufatsa sebaka sa phetisetso ea matšoao le ho fokotsa tahlehelo ea phetisetso ea matšoao, boto ea puisano ea 5G.

Mohato ka mohato ho ea ho lithapo tse matla haholo, sebaka se setle sa terata, to ile a nts'etsopele tataiso ea micro-aperture, mofuta o mosesaane le ho tšepahala ho phahameng.

Ntlafatso e tebileng ea theknoloji ea ts'ebetso le ts'ebetso ea tlhahiso ea lisinki le li-circuits, ho feta litšitiso tsa tekheniki.Eba moetsi ea khabane oa boto ea PCB ea puisano e phahameng ea 5G.

PCB电路板线路板生产加工制造厂家汇和电路通信设备

Indasteri ea Lipuisano Le Lihlahisoa tsa PCB

Indasteri ea puisano Lisebelisoa tse ka sehloohong Lihlahisoa tse hlokahalang tsa PCB Karolo ea PCB
 

Marang-rang a se nang mohala

 

Seteishene sa motheo sa puisano

Boto e ka morao, boto ea li-multilayer e lebelo le holimo, boto ea microwave e nang le maqhubu a mangata, karolo e ka tlase ea tšepe e sebetsang ka bongata.  

Metal base, boholo bo boholo, multilayer e phahameng, lisebelisoa tse phahameng tsa maqhubu le motlakase o tsoakiloeng  

 

 

Marang-rang a phetiso

Thepa ea phetisetso ea OTN, sesebelisoa sa phetiso ea microwave e ka morao, boto ea multilayer e lebelo le holimo, boto ea microwave e phahameng haholo. Sefofane se ka morao, boto ea multilayer e lebelo le holimo, boto ea microwave e nang le maqhubu a phahameng haholo  

Lintho tse nang le lebelo le phahameng, boholo bo boholo, li-multilayer tse phahameng, li-high density, mokokotlo oa mokokotlo, motsoako o thata-flexible, lisebelisoa tse phahameng tsa maqhubu le khatello e tsoakiloeng.

Puisano ya data  

Li-routers, li-switches, tšebeletso / polokelo Devic

 

Semela se ka morao, boto ea multilayer e lebelo le holimo

Lintho tse nang le lebelo le phahameng, boholo bo boholo, li-multi-layer tse phahameng, li-high density, mokokotlo oa mokokotlo, motsoako o thata-flex
Broadband e tsitsitseng ea marang-rang  

OLT, ONU le lisebelisoa tse ling tsa fiber-to-the-hae

Lintho tse nang le lebelo le phahameng, boholo bo boholo, li-multi-layer tse phahameng, li-high density, mokokotlo oa mokokotlo, motsoako o thata-flex  

Multilay

PCB Ea Lisebelisuoa Tsa Lipuisano Le Mobile Terminal

Lisebelisoa tsa Puisano

Phanele e le 'ngoe / habeli
%
4 lera
%
6 lera
%
8-16 lera
%
ka holimo ho 18 layer
%
HDI
%
PCD e feto-fetohang
%
Sephutheloana sa substrate
%

Mobile Terminal

Phanele e le 'ngoe / habeli
%
4 lera
%
6 lera
%
8-16 lera
%
ka holimo ho 18 layer
%
HDI
%
PCD e feto-fetohang
%
Sephutheloana sa substrate
%

Bothata ba Ts'ebetso ea Boto e Phahameng ea Maqhubu le Lebelo le Phahameng la PCB

Ntlha e thata Mathata
Ho nepahala ha ho tsamaisana Ho nepahala ho thata haholoanyane, 'me ho tsamaisana ha li-interlayer ho hloka ho kopana ha mamello.Mofuta ona oa ho kopana o thata haholoanyane ha boholo ba poleiti bo fetoha
STUB (Ho se tsoelepele ho sitisang) STUB e thata haholoanyane, botenya ba poleiti bo thata haholo, 'me ho hlokahala theknoloji ea ho phunya ka morao
 

Ho nepahala ha impedance

Ho na le phephetso e kholo ho etching: 1. Lintho tse hlabang: tse nyenyane li molemo, ho mamella ho nepahala ha etching ho laoloa ke + /-1MIL bakeng sa lineweights tsa 10mil le ka tlase, le + /-10% bakeng sa mamello ea linewidth ka holimo ho 10mil.2. Litlhoko tsa bophara ba mela, sebaka sa mela le botenya ba mola li phahame.3. Tse ling: ho teteana ha wiring, ho kena-kenana le pontšo ea interlayer
Keketseho e eketsehileng ea tahlehelo ea matšoao Ho na le phephetso e kholo ea ho phekola holim'a li-laminate tsohle tsa koporo;ho hlokahala tolerances phahameng PCB botenya, ho akarelletsa le bolelele, bophara, botenya, verticality, seqha le khopameng, joalo-joalo.
Boholo bo ntse bo hola The machinability e ba mpe le ho feta, ho tsamaisoa ho mpefala, 'me lesoba le foufetseng le hloka ho patoa.Theko ea eketseha2. Ho nepahala ha tlhophiso ho thata haholoanyane
Palo ea lihlopha e ba holimo Litšobotsi tsa mela e teteaneng le ka tsela, boholo ba yuniti e kholoanyane le lesela le tšesaane la dielectric, le litlhoko tse thata ho feta bakeng sa sebaka se ka hare, ho hokahanya ha interlayer, taolo ea impedance le ho ts'epahala.

Boiphihlelo bo Bokeletseng ho Boto ea Phatlalatso ea Tlhahiso ea HUIHE Lipotoloho

Litlhoko tse phahameng tsa density:

Phello ea crosstalk (lerata) e tla fokotseha ka ho fokotseha ha melahare / sebaka.

Litlhokahalo tse thata tsa impedance:

Ho tsamaisana le litšobotsi ke tlhokahalo ea mantlha ea boto ea microwave e phahameng haholo.E kholoanyane ea ho itšireletsa, ke hore, bokhoni bo boholo ba ho thibela letšoao ho kena ka har'a lera la dielectric, ka potlako ho fetisa pontšo le tahlehelo e nyenyane.

Ho nepahala ha tlhahiso ea likhoele tsa phetiso ea hlokahala hore e be holimo:

Ho fetisoa ha lets'oao la maqhubu a phahameng ho thata haholo bakeng sa ts'itiso ea terata e hatisitsoeng, ke hore, bonnete ba tlhahiso ea mohala oa phetiso hangata o hloka hore moeli oa mohala oa phetiso o be makhethe haholo, o se ke oa burr, notch kapa terata. ho tlatsa.

Litlhoko tsa mochini:

Pele ho tsohle, thepa ea boto ea microwave e phahameng-frequency e fapane haholo le lisebelisoa tsa lesela la khalase ea epoxy ea boto e hatisitsoeng;ea bobeli, ho nepahala ha machining ea boto ea microwave e phahameng-frequency e phahame haholo ho feta ea boto e hatisitsoeng, 'me mamello ea sebopeho ka kakaretso ke ± 0.1mm (tabeng ea ho nepahala ho phahameng, mamello ea sebopeho ke ± 0.05mm).

Khatello e kopaneng:

Tšebeliso e tsoakiloeng ea "high-frequency substrate" (PTFE class) le "high-speed substrate" (PPE class) e etsa hore boto ea potoloho ea lebelo le phahameng e se ke ea e-ba le sebaka se seholo sa conduction feela, empa hape e na le litlhoko tse tsitsitseng tsa dielectric, tse phahameng tsa tšireletso ea dielectric. le ho hanyetsa mocheso o phahameng.Ka nako e ts'oanang, ts'ebetso e mpe ea delamination le khatello e tsoakiloeng ea warping e bakoang ke phapang ea ho khomarela le coefficient ea ho atolosa mocheso pakeng tsa lipoleiti tse peli tse fapaneng li lokela ho rarolloa.

Ho hlokahala hore ho be le ho tšoana ho holimo ha coating:

Tšitiso ea tšobotsi ea mohala oa phetisetso oa boto ea microwave e phahameng e ama ka kotloloho boleng ba phetisetso ea lets'oao la microwave.Ho na le kamano e itseng pakeng tsa tšobotsi impedance le botenya ba foil koporo, haholo-holo bakeng sa poleiti microwave e nang le masoba metallized, botenya barbotage ha feela ama botenya kakaretso ea koporo foil, empa hape ama ho nepahala ha terata ka mor'a hore etching. .ka hona, boholo le ho tšoana ha botenya ba ho roala bo lokela ho laoloa ka thata.

Ts'ebetso ea laser micro-through hole:

Tšobotsi ea bohlokoa ea boto e phahameng haholo bakeng sa puisano ke sekoti se nang le sekoti se foufetseng / se patiloeng (aperture ≤ 0.15mm).Hajoale, ts'ebetso ea laser ke mokhoa o ka sehloohong oa ho theha likoti tse nyane.Karo-karolelano ea bophara ba lesoba ho bophara ba poleiti e kopanyang e ka fapana ho tloha ho mofani ho ea ho mofani.Karo-karolelano ea bophara ba lesoba ho poleiti e kopanyang e amana le ho nepahala ha boemo ba borehole, 'me ha lihlopha li le ngata, ho ka ba le ho kheloha ho hoholo.hajoale, hangata e amohetsoe ho latela sebaka seo ho shebiloeng ho sona ho latela lera.Bakeng sa lithapo tse phahameng haholo, ho na le li-disc tse sa kopaneng ka masoba.

Phekolo ea holim'a metsi e rarahane haholoanyane:

Ka ho eketseha ha makhetlo a mangata, khetho ea phekolo ea holim'a metsi e fetoha ea bohlokoa le ho feta, 'me ho roala ka motlakase o motle oa motlakase le ho roala ha mosesaane ho na le tšusumetso e fokolang holim'a pontšo."Bothata" ba terata bo tlameha ho lumellana le botenya ba phetisetso eo pontšo ea phetisetso e ka e amohelang, ho seng joalo ho bonolo ho hlahisa pontšo e tebileng "leqhubu le emeng" le "reflection" joalo-joalo.Inertia ea molek'hule ea li-substrates tse khethehileng tse kang PTFE e etsa hore ho be thata ho kopanya le foil ea koporo, kahoo ho hlokahala phekolo e khethehileng ea holim'a metsi ho eketsa ho hlaka holimo kapa ho eketsa filimi e khomarelang pakeng tsa foil ea koporo le PTFE ho ntlafatsa ho khomarela.