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4 Layer ENIG FR4 Half Hole PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 9/4mil
Lera le ka hare W/S: 7/4mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng:Impedance, halofo ea lesoba
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6 Layer ENIG Impedance Half Hole PCB
Likarolo: 6
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/4mil
Lera le ka hare W/S: 4/4mil
Botenya: 1.2mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng:Impedance, halofo ea lesoba -
4 Lera HASL FR4 Half Hole PCB
Likarolo: 4
Qetello ea bokaholimo: LF-HASL
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 9/6mil
Lera le ka hare W/S: 9/5mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.3mm
Mokhoa o khethehileng: halofo ea lesoba -
4 Layer ENIG FR4 Half Hole PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/3mil
Lera le ka hare W/S: 6/4mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: halofo ea lesoba -
4 Layer ENIG FR4 Half Hole PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 8/4mil
Lera le ka hare W/S: 8/4mil
Boima: 0.6mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: halofo ea lesoba -
4 Layer ENIG Impedance Half Hole PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 6/4mil
Lera le ka hare W/S: 6/4mil
Boima: 0.4mm
Min.bophara ba lesoba: 0.6mm
Ts'ebetso e khethehileng:Impedance, halofo ea lesoba -
2 Lera HASL FR4 Half Hole PCB
Likarolo: 2
Qetello ea bokaholimo: LF-HASL
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 9/5mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.4mm
Mokhoa o khethehileng: halofo ea lesoba -
8 Layer ENIG FR4 Half Hole PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/3mil
Lera le ka hare W/S: 5/4mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.2mm -
4 Layer ENIG FR4 Half Hole PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/4mil
Lera le ka hare W/S: 4/4mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.15mm
