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2 Layer High Tg Heavy Copper PCB
Lebitso la sehlahisoa: 2 Layer High Tg Heavy Copper PCB
Palo ea mekhahlelo: 2
Qetello ea bokaholimo: HASL
Boitsebiso ba motheo: Tg170 FR4
Botenya: 1mm
Min.bophara ba lesoba: 0.5mm
Ts'ebetso e khethehileng: Ho hanyetsa Coil, Koporo e Boima -
6 Lera ENIG Boima Koporo PCB
Lebitso la sehlahisoa: 6 Layer ENIG Heavy Copper PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 10/5mil
Lera le ka hare W/S: 7/5mil
Boima: 1.6mm
Min.bophara ba lesoba: 0.25mm
Mokhoa o khethehileng: Koporo e boima -
4 Layer ENIG Impedance Control e Boima Koporo PCB
Lebitso la sehlahisoa: 4 Layer ENIG Impedance Control Boima ba Koporo PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4 S1141
Lera la Kantle W/S: 5.5/3.5mil
Lera le ka hare W/S: 5/4mil
Boima: 1.6mm
Min.bophara ba lesoba: 0.25mm
Ts'ebetso e khethehileng: Taolo ea Impedans + Koporo e Boima -
6 Lera ENIG Boima Koporo PCB
Lebitso la sehlahisoa: 6 Layer ENIG Heavy Copper PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4/2.5mil
Lera le ka hare W/S: 4/3.5mil
Botenya: 1.2mm
Min.bophara ba lesoba: 0.2mm -
2 Lera ENIG Boima Koporo PCB
Lebitso la sehlahisoa: 2 layer ENIG Heavy Copper PCB
Likarolo: 2
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 11/4mil
Botenya: 2.5mm
Min.bophara ba lesoba: 0.35mm -
6 Layer ENIG Impedance Control e Boima Koporo PCB
Lebitso la sehlahisoa: 6 Layer ENIG Impedance Control Boima ba Koporo PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4/4mil
Lera le ka hare W/S: 4/4mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: Taolo ea Impedans + Koporo e Boima -
4 Layer HASL Impedance Control e Boima Koporo PCB
Lebitso la sehlahisoa: 4 Layer HASL Impedance Control e boima ba Koporo PCB
Likarolo:4
Qetello ea bokaholimo: HASL
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 5.5/11mil
Lera le ka hare W: 15mil
Botenya: 1.2mm
Min.bophara ba lesoba: 0.3mm
Ts'ebetso e khethehileng: Taolo ea Impedans + Koporo e Boima -
8 Layer ENIG Impedance Control e Boima Koporo PCB
Lebitso la sehlahisoa: 8 Layer ENIG Impedance Control Boima ba Koporo PCB
Likarolo: 8
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 7/4mil
Lera le ka hare W/S: 5/4.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: Taolo ea Impedans + Koporo e Boima
