computer-repair-london

Lehae
  • Lihlahisoas
    • 6 Layer ENIG Via-In-Pad PCB

      6 Layer ENIG Via-In-Pad PCB

      Lebitso la sehlahisoa: 6 Layer ENIG Via-In-Pad PCB
      Likarolo: 6
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      W/S: 5/4mil
      Botenya: 1.0mm
      Min.bophara ba lesoba: 0.2mm
      Mokhoa o khethehileng: ka-ka-pad

    • 8 Layer ENIG Via-In-Pad PCB

      8 Layer ENIG Via-In-Pad PCB

      Lebitso la sehlahisoa: 8 Layer ENIG Via-In-Pad PCB
      Likarolo: 8
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      Lera la Kantle W/S: 4.5/3.5mil
      Lera le ka hare W/S: 4.5/3.5mil
      Botenya: 1.2mm
      Min.bophara ba lesoba: 0.15mm
      Mokhoa o khethehileng: ka-ka-pad

    • 6 Layer ENIG Via-In-Pad PCB

      6 Layer ENIG Via-In-Pad PCB

      Lebitso la sehlahisoa: 6 Layer ENIG Via-In-Pad PCB
      Likarolo: 6
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      Lera la Kantle W/S: 7/3.5mil
      Lera le ka hare W/S: 7/4mil
      Botenya: 0.8mm
      Min.bophara ba lesoba: 0.2mm
      Mokhoa o khethehileng: ka-ka-pad

    • 6 Layer ENIG Via-In-Pad PCB

      6 Layer ENIG Via-In-Pad PCB

      Lebitso la sehlahisoa: 6 Layer ENIG Via-In-Pad PCB
      Likarolo: 6
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      Lera la Kantle W/S: 4/3.5mil
      Lera le ka hare W/S: 4/3.5mil
      Botenya: 2.0mm
      Min.bophara ba lesoba: 0.25mm
      Ts'ebetso e khethehileng: ka-in-pad Impedance Control

    • 10 Layer Impedance Control Resin Plugging PCB

      10 Layer Impedance Control Resin Plugging PCB

      Lebitso la sehlahisoa: 10 Layer Impedance Control Resin Plugging PCB
      Likarolo: 10
      Qetello e holimo: ENIG
      Karo-karolelano: 8:1
      Lisebelisoa tsa motheo: FR4
      Lera la Kantle W/S: 4/4mil
      Lera le ka hare W/S: 5/3.5mil
      Botenya: 2.0mm
      Min.bophara ba lesoba: 0.25mm
      Ts'ebetso e khethehileng: Taolo ea Impedans, Plugging ea Resin, Botenya bo fapaneng ba Koporo

    • 8 Layer ENIG Via-In-Pad PCB

      8 Layer ENIG Via-In-Pad PCB

      Lebitso la sehlahisoa: 8 Layer ENIG Via-In-Pad PCB
      Likarolo: 8
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      Lera la Kantle W/S: 4/3.5mil
      Lera le ka hare W/S: 4/3.5mil
      Botenya: 1.0mm
      Min.bophara ba lesoba: 0.2mm
      Ts'ebetso e khethehileng: ka-ka-pad, taolo ea impedance

    • 6 Layer ENIG Impedance Control PCB

      6 Layer ENIG Impedance Control PCB

      Lebitso la sehlahisoa: 6 Layer ENIG Impedance Control PCB
      Likarolo: 6
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      Lera la Kantle W/S: 4/3.5mil
      Lera le ka hare W/S: 4.5/3.5mil
      Botenya: 1.0mm
      Min.bophara ba lesoba: 0.2mm
      Ts'ebetso e khethehileng: Taolo ea Impedans

    • 16 Layer ENIG Press Fit Hole PCB

      16 Layer ENIG Tobetsa Fit Hole PCB

      Lebitso la sehlahisoa: 16 Layer ENIG Press Fit Hole PCB
      Likarolo: 16
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      Botenya: 3.0mm
      Min.bophara ba lesoba: 0.35mm
      boholo: 420×560mm
      Lera la Kantle W/S: 4/3mil
      Lera le ka hare W/S: 5/4mil
      Karo-karolelano: 9:1
      Ts'ebetso e khethehileng: ka-in-pad Impedance Control Tobetsa Fit Hole

    • 8 Layer FPC+FR4 Rigid-Flex PCB

      8 Layer FPC+FR4 Rigid-Flex PCB

      Lebitso la sehlahisoa: 8 Layer FPC + FR4 Rigid-Flex PCB
      Lera: 8
      Indasteri ea Kopo: Taolo ea Liindasteri
      W/S: 5/5mil
      Botenya ba Boto: 1.6mm
      Min.Bophara ba lesoba: 0.2mm
      Qetello ea Bokaholimo: ENIG
      lintho tse bonahalang: FR4 + FPC
      laminate: 2R+2F+2F+2R

    • 8 Layer FPC+FR4 Rigid Flex PCB

      8 Layer FPC+FR4 Rigid Flex PCB

      Lebitso la sehlahisoa: 8 Layer FPC + FR4 Rigid Flex PCB
      Palo ea mekhahlelo: 8
      Indasteri ea Kopo: Taolo ea Liindasteri
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4 + FPC
      W/S: 5/5mil
      Boima: 1.6mm
      Min.bophara ba lesoba: 0.2mm
      laminate: 2R+2F+2F+2R

    • 6 Layer FPC+FR4 Rigid-Flex PCB

      6 Layer FPC+FR4 Rigid-Flex PCB

      Lebitso la sehlahisoa: 6 Layer FPC + FR4 Rigid-Flex PCB
      Lera: 6
      Indasteri ea Kopo: Setsi sa moea sa bongaka
      W/S: 4/4mil
      Botenya ba Boto: 0.8mm
      Min.Bophara ba lesoba: 0.15mm
      Qetello ea Bokaholimo: ENIG
      lintho tse bonahalang: FR4 + FPC

    • 6 Layer ENIG Impedance Control PCB

      6 Layer ENIG Impedance Control PCB

      Lebitso la sehlahisoa: 6 Layer ENIG Impedance Control PCB
      Likarolo: 6
      Qetello e holimo: ENIG
      Lisebelisoa tsa motheo: FR4
      Lera la Kantle W/S: 4/3mil
      Lera le ka hare W/S: 5/4mil
      Botenya: 0.8mm
      Min.bophara ba lesoba: 0.2mm
      Mokhoa o khethehileng: taolo ea impedance

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