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6 Layer ENIG Via-In-Pad PCB
Lebitso la sehlahisoa: 6 Layer ENIG Via-In-Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
W/S: 5/4mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: ka-ka-pad -
8 Layer ENIG Via-In-Pad PCB
Lebitso la sehlahisoa: 8 Layer ENIG Via-In-Pad PCB
Likarolo: 8
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4.5/3.5mil
Lera le ka hare W/S: 4.5/3.5mil
Botenya: 1.2mm
Min.bophara ba lesoba: 0.15mm
Mokhoa o khethehileng: ka-ka-pad -
6 Layer ENIG Via-In-Pad PCB
Lebitso la sehlahisoa: 6 Layer ENIG Via-In-Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 7/3.5mil
Lera le ka hare W/S: 7/4mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: ka-ka-pad -
6 Layer ENIG Via-In-Pad PCB
Lebitso la sehlahisoa: 6 Layer ENIG Via-In-Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4/3.5mil
Botenya: 2.0mm
Min.bophara ba lesoba: 0.25mm
Ts'ebetso e khethehileng: ka-in-pad Impedance Control -
10 Layer Impedance Control Resin Plugging PCB
Lebitso la sehlahisoa: 10 Layer Impedance Control Resin Plugging PCB
Likarolo: 10
Qetello e holimo: ENIG
Karo-karolelano: 8:1
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4/4mil
Lera le ka hare W/S: 5/3.5mil
Botenya: 2.0mm
Min.bophara ba lesoba: 0.25mm
Ts'ebetso e khethehileng: Taolo ea Impedans, Plugging ea Resin, Botenya bo fapaneng ba Koporo -
8 Layer ENIG Via-In-Pad PCB
Lebitso la sehlahisoa: 8 Layer ENIG Via-In-Pad PCB
Likarolo: 8
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4/3.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: ka-ka-pad, taolo ea impedance -
6 Layer ENIG Impedance Control PCB
Lebitso la sehlahisoa: 6 Layer ENIG Impedance Control PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4.5/3.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: Taolo ea Impedans -
16 Layer ENIG Tobetsa Fit Hole PCB
Lebitso la sehlahisoa: 16 Layer ENIG Press Fit Hole PCB
Likarolo: 16
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Botenya: 3.0mm
Min.bophara ba lesoba: 0.35mm
boholo: 420×560mm
Lera la Kantle W/S: 4/3mil
Lera le ka hare W/S: 5/4mil
Karo-karolelano: 9:1
Ts'ebetso e khethehileng: ka-in-pad Impedance Control Tobetsa Fit Hole -
8 Layer FPC+FR4 Rigid-Flex PCB
Lebitso la sehlahisoa: 8 Layer FPC + FR4 Rigid-Flex PCB
Lera: 8
Indasteri ea Kopo: Taolo ea Liindasteri
W/S: 5/5mil
Botenya ba Boto: 1.6mm
Min.Bophara ba lesoba: 0.2mm
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: FR4 + FPC
laminate: 2R+2F+2F+2R -
8 Layer FPC+FR4 Rigid Flex PCB
Lebitso la sehlahisoa: 8 Layer FPC + FR4 Rigid Flex PCB
Palo ea mekhahlelo: 8
Indasteri ea Kopo: Taolo ea Liindasteri
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4 + FPC
W/S: 5/5mil
Boima: 1.6mm
Min.bophara ba lesoba: 0.2mm
laminate: 2R+2F+2F+2R -
6 Layer FPC+FR4 Rigid-Flex PCB
Lebitso la sehlahisoa: 6 Layer FPC + FR4 Rigid-Flex PCB
Lera: 6
Indasteri ea Kopo: Setsi sa moea sa bongaka
W/S: 4/4mil
Botenya ba Boto: 0.8mm
Min.Bophara ba lesoba: 0.15mm
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: FR4 + FPC -
6 Layer ENIG Impedance Control PCB
Lebitso la sehlahisoa: 6 Layer ENIG Impedance Control PCB
Likarolo: 6
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4
Lera la Kantle W/S: 4/3mil
Lera le ka hare W/S: 5/4mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: taolo ea impedance
