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8 Layer ENIG FR4 Via-In-Pad PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4.5/3.5mil
Lera le ka hare W/S: 4.5/3.5mil
Botenya: 1.2mm
Min.lesoba bophara: 0.15mm
Mokhoa o khethehileng: ka-ka-pad
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6 Layer FR4 ENIG Via In Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4.5/3.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: ka pad
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10 Layer Impedance Control Resin Plugging PCB
Likarolo: 10
Qetello e holimo: ENIG
Karo-karolelano: 8:1
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/4mil
Lera le ka hare W/S: 5/3.5mil
Botenya: 2.0mm
Min.bophara ba lesoba: 0.25mm
Ts'ebetso e khethehileng: Taolo ea Impedans, Plugging ea Resin, Botenya bo fapaneng ba Koporo
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10 Layer ENIG FR4 Impedance Control PCB
Likarolo: 10
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/4mil
Lera le ka hare W/S: 5/3.5mil
Botenya: 2.0mm
Min.bophara ba lesoba: 0.25mm
Botenya ba bophara karo: 8: 1
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8 Layer ENIG FR4 Via-In-Pad PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4/3.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: ka-ka-pad, taolo ea impedance
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4 Layer ENIG RO4003 + AD255 Mixed Lamination PCB
Likarolo: 4
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: Arlon AD255+Rogers RO4003C
Min.bophara ba lesoba: 0.5mm
Bonyane W/S:7/6mil
Botenya: 1.8mm
Mokhoa o khethehileng: Lesoba le foufetseng -
12 Layer FR4 ENIG Impedance Control PCB
Likarolo: 12
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 5/4mil
Lera le ka hare W/S: 4/5mil
Botenya: 3.0mm
Min.bophara ba lesoba: 0.3mm
Ts'ebetso e khethehileng: mohala oa taolo ea impedance ea 5 / 5mil -
6 Layer ENIG Automotive Radar Rigid Flex PCB
Lera: 6
W/S: 4/4mil
Botenya ba Boto: 1.6mm
Min.Bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: boemo ba 1 HDI
Sefofu Ka:0.07mm
Qetello ea Bokaholimo: ENIG
laminate: 2R+2F+2R
Indasteri ea kopo: radar ea likoloi -
8 Layer ENIG FR4 Multilayer PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/4mil
Lera le ka hare W/S: 3.5/3.5mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.45mm -
4 Layer ENIG FR4 Sefofu se Patoa Ka PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4 Tg170
Lera la Kantle W/S: 5.5/6mil
Lera le ka hare W/S: 17.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.5mm
Mokhoa o khethehileng: Blind Vias -
10 Layer ENIG FR4 Via In Pad PCB
Lera: 10
Qetello e holimo: ENIG
lintho tse bonahalang: FR4 Tg170
Mohala oa ka ntle W/S: 10/7.5mil
Ka hare mola W/S: 3.5/7mil
Botenya ba boto: 2.0mm
Min.bophara ba lesoba: 0.15mm
Plug Hole: ka ho tlatsa plating -
4 Layer ENIG FR4 Half Hole PCB
Likarolo: 4
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 9/4mil
Lera le ka hare W/S: 7/4mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng:Impedance, halofo ea lesoba
