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6 Layer ENIG Automotive Radar Rigid Flex PCB
Lera: 6
W/S: 4/4mil
Botenya ba Boto: 1.6mm
Min.Bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: boemo ba 1 HDI
Sefofu Ka:0.07mm
Qetello ea Bokaholimo: ENIG
laminate: 2R+2F+2R
Indasteri ea kopo: radar ea likoloi -
8 Layer ENIG Industrial Control Rigid Flex PCB
Likarolo: 8
Indasteri ea Kopo: Taolo ea Liindasteri
Qetello e holimo: ENIG
W/S: 6/6mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.2mm
laminate: 1R+2R+2F+2R+1R -
4 Layer ENIG FPC+FR4 Rigid-Flex PCB
Lera: 4
Indasteri ea Kopo: Taolo ea Liindasteri
W/S: 6/6mil
Botenya ba Boto: 0.4mm
Min.Bophara ba lesoba: 0.2mm
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: FR4 + FPC
laminate: 1F+2R+1R -
8 Layer FPC+FR4 Rigid Flex PCB
Likarolo: 8
Indasteri ea Kopo: Taolo ea Liindasteri
Qetello e holimo: ENIG
Lisebelisoa tsa motheo: FR4 + FPC
W/S: 5/5mil
Botenya: 1.6mm
Min.bophara ba lesoba: 0.2mm
laminate: 2R+2F+2F+2R -
4 Layer FPC+FR4 Rigid Flex PCB
Lera: 4
Ts'ebetso e khethehileng: Rigid-Flex
lintho tse bonahalang: FR4 + FPC
Outer Track W/S: 4/3.5mil
Pina e ka Hare W/S: 5/4mil
Botenya ba Boto: 0.5mm
Min.Bophara ba lesoba: 0.2mm -
8 Layer ENIG FPC+FR4 Rigid-Flex PCB
Lera: 8
Indasteri ea Kopo: Taolo ea Liindasteri
W/S: 5/5mil
Botenya ba Boto: 1.6mm
Min.Bophara ba lesoba: 0.2mm
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: FR4 + FPC
laminate: 2R+2F+2F+2R -
6 Layer ENIG FPC+FR4 Rigid-Flex PCB
Lera: 6
Indasteri ea Kopo: Setsi sa moea sa bongaka
W/S: 4/4mil
Botenya ba Boto: 0.8mm
Min.Bophara ba lesoba: 0.15mm
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: FR4 + FPC -
8 Layer HASL FPC+FR4 Rigid-Flex PCB
Lera: 8
Indasteri ea Kopo: Setsi sa moea sa bongaka
W/S: 4/4mil
Botenya ba Boto: 1.6mm
Min.Bophara ba lesoba: 0.2mm
Qetello ea Bokaholimo: HASL
lintho tse bonahalang: FR4 + FPC
laminate:1R+2R+2F+2R+1F -
4 Layer ENIG SF302 + FR4 Rigid-Flex PCB
Lera: 4
Ts'ebetso e Khethehileng: Rigid-Flex Board
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: SF302+FR4
Outer Track W/S: 5/5mil
Pina e ka Hare W/S: 6/6mil
Botenya ba Boto: 1.0mm
Min.Bophara ba lesoba: 0.3mm -
4 Layer ENIG FPC+FR4 Rigid-Flex PCB
Lera: 4
Ts'ebetso e Khethehileng: Rigid-Flex Board
Qetello ea Bokaholimo: ENIG
lintho tse bonahalang: FR4 + FPC
Outer Track W/S: 3.5/3.5mil
Pina e ka Hare W/S: 4/4mil
Botenya ba Boto: 0.5mm
Min.Bophara ba lesoba: 0.2mm
