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16 Layer ENIG Tobetsa Fit Hole PCB
Likarolo: 16
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Botenya: 3.0mm
Min.bophara ba lesoba: 0.35mm
Boholo: 420 × 560mm
Lera la Kantle W/S: 4/3mil
Lera le ka hare W/S: 5/4mil
Karo-karolelano: 9:1
Ts'ebetso e khethehileng: ka-ka-pad, taolo ea impedance, tobetsa lesoba le lekanang
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6 Layer ENIG FR4 Via-In-Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4/3.5mil
Botenya: 2.0mm
Min.bophara ba lesoba: 0.25mm
Ts'ebetso e khethehileng: ka-ka-pad, taolo ea impedance
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6 Layer ENIG FR4 Via-In-Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
W/S: 5/4mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: ka-ka-pad
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6 Layer ENIG Via-In-Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 7/3.5mil
Lera le ka hare W/S: 7/4mil
Botenya: 0.8mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: ka-ka-pad
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8 Layer ENIG FR4 Via-In-Pad PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4.5/3.5mil
Lera le ka hare W/S: 4.5/3.5mil
Botenya: 1.2mm
Min.lesoba bophara: 0.15mm
Mokhoa o khethehileng: ka-ka-pad
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6 Layer FR4 ENIG Via In Pad PCB
Likarolo: 6
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4.5/3.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Mokhoa o khethehileng: ka pad
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8 Layer ENIG FR4 Via-In-Pad PCB
Likarolo: 8
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 4/3.5mil
Lera le ka hare W/S: 4/3.5mil
Botenya: 1.0mm
Min.bophara ba lesoba: 0.2mm
Ts'ebetso e khethehileng: ka-ka-pad, taolo ea impedance
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10 Layer ENIG FR4 Via In Pad PCB
Lera: 10
Qetello e holimo: ENIG
lintho tse bonahalang: FR4 Tg170
Mohala oa ka ntle W/S: 10/7.5mil
Ka hare mola W/S: 3.5/7mil
Botenya ba boto: 2.0mm
Min.bophara ba lesoba: 0.15mm
Plug Hole: ka ho tlatsa plating
