12 Layer HASL Multilayer FR4 PCB
Hobaneng o Khetha Lipotoloho tsa HUIHE Bakeng sa Multilayer PCB?
1. Theknoloji e nepahetseng:e khona ho sebetsana le mefuta eohle ea PCB e nepahetseng le e thata haholo, e nang le likarolo tse 28 le sebaka sa mela e 3/3mil.
2.Tlhahiso ea Setsebi:Mohlala oa PCB, PCB e phahameng haholotlhokeho ya taelo
3. Thepa e tsoetseng pele:mochine o ikemetseng oa koporo / mohala oa electroplating, mochine oa LDI / CCD oa ho pepeseha le lisebelisoa tse ling ho hlahisa lihlahisoa tsa boleng bo phahameng le tse phahameng.
Melemo ea rona ea ho etsa Multilayer PCB
Joaloka moetsi oa PCB ea hloahloa, HUIHE Circuits Co., Ltd. e tsepamisitse maikutlo ho lipatlisiso le nts'etsopele ea liboto tsa PCB tsa multilayer tse nepahetseng haholo le liboto tse khethehileng tsa PCB.Hape ke setsi sa tlhahiso ea li-prototyping tsa PCB le liboto tsa molumo, tse nang le sebaka sa semela sa lisekoere-mithara tse 12000.
HUIHE Circuits e na le phihlelo ea sehlopha sa tekheniki, e tseba bokhoni bo tsoetseng pele ba theknoloji ea indasteri, e nang le lisebelisoa tse ka tšeptjoang tsa tlhahiso ea othomathike, lisebelisoa tsa tlhahlobo le laboratori ea 'mele le ea lik'hemik'hale e sebetsang ka botlalo.Lihlahisoa tsa PCB li kenyelletsa 2-28 layer precision multilayer PCB,PCB e phahameng haholo, PCB ea koporo e boima, ka-ka-pad PCB, laminate e mahareng e tsoakiloeng, PCB e patiloeng e sa boneng,Tg PCB e phahameng, metallized halofo ea lesoba PCB, joalo-joalo.
Ho fumana lintlha tse ling le hore na re ka u thusa joang, ka kopo re romelle lipotso tsa hau ka lengolo-tsoibilaem01@huihepcb.com.Haeba o hloka prototype e phahameng ea multilayer PCB / tlhokahalo ea molumo o feto-fetohang, ka kopo ikutloe u lokolohile hoiteanye le rona!
Mefuta e sa tšoaneng ea Mekhoa ea PCB
Regid-Flex PCB
E bonolo ebile e tšesaane, e nolofatsa mokhoa oa ho kopanya sehlahisoa
Fokotsa lihokelo, bokhoni ba ho jara mela e phahameng
E sebelisoa tsamaisong ea litšoantšo le lisebelisoa tsa puisano tsa RF
Multilayer PCB
Bonyane bophara ba mela le sebaka sa mela 3/3mil
BGA 0.4 pitch, bonyane lesoba 0.1mm
E sebelisoa taolong ea indasteri le lisebelisoa tsa elektroniki tsa bareki
Laola ka thata bophara ba conductor/botenya le botenya bo mahareng
Mamello ea bophara ba moeli ≤± 5%, papali e ntle ea impedance
E sebelisoa ho lisebelisoa tse phahameng le tse lebelo le lisebelisoa tsa puisano tsa 5g
Ha ho na meutloa ea koporo e setseng kapa e sothehang ka har'a mokoti o halofo
Boto ea ngoana ea boto ea 'mè e boloka lihokelo le sebaka
E kentsoe mojuleng oa Bluetooth, moamoheli oa lets'oao
