16 Lera Phahameng Tg ENIG PCB
Mabapi le High Tg PCB
Boto ea potoloho e phahameng ea Tg PCB ha e le hantle e hlalosoa e le lisebelisoa tse tala tsa PCB kapa e etselitsoe ho mamella mocheso o phahameng ka mocheso o phahameng oa PCB, Tg e phahameng hangata e phahame ho feta 170 ° C.Ka hona, PCB e nang le TG e kholo ho feta kapa e lekanang le 170 ° C e phahameng Tg PCB, e ka boela ea bitsoa mocheso oa phetoho ea khalase.Ho hanyetsa mocheso o phahameng, hangata ho sebelisoa ts'ebetsong e se nang loto.
Melemo ea Rōna
Feme ea hau, sebaka sa fektheri 12000 square metres, thekiso e tobileng ea feme
Teko ea 100% ea sehlahisoa (AOI scanning, 100% Flying Probe Test, FQC tlhahlobo e felletseng) ho fokotsa sekhahla sa sekoli sa sehlahisoa.
Ka mefuta e fapaneng ea setifikeiti sa ISO, e tsamaellanang le litekanyetso tsa tlhahlobo tsa machaba tsa IPC
Mokhoa oa ho khetholla lisebelisoa tse phahameng tsa Tg?
| Lisebelisoa | Tg | MOTHO |
| FR4-e tloaelehileng Tg | 130 ℃ | 110 ℃ |
| FR4-MediumTg | 150 ℃ | 130 ℃ |
| FR4-holimo Tg | 170 ℃ | 150 ℃ |
| polyimide-Ultra phahameng Tg | 260 ℃ | 240 ℃ |
Litekanyetso tsa TG tsa Lisebelisoa tse Tloaelehileng
| Lisebelisoa | Tg boleng |
| CEM-1 | 110-130 ℃ |
| FR4 | 120-180 ℃ |
| PTFE | 200-260 ℃ |
| ceramic | 200-300 ℃ |
| polyimide | 200-350 ℃ |
FR4 TG hangata ke 130-140 ℃, 'me TG e bohareng hangata e phahame ho feta 150-160℃.Ho hanyetsa mongobo, ho hanyetsa mocheso, botsitso, lik'hemik'hale tsa lik'hemik'hale le thepa e meng ea PCB nakong ea ho etsoa ha boto e phahameng ea Tg PCB e itšetlehile ka ho toba mocheso oa phetoho ea khalase.
Re ka u thusa ho tseba hore na liboto tsa potoloho tse hatisitsoeng tse hanyetsanang le mocheso o phahameng lia hlokahala le ho u tataisa hore u khethe boto ea potoloho e phahameng ea Tg PCB.Haeba sehlahisoa sa hau se tloha ho se se nang lead ho ea ho litaelo tsa RoHS, kapa haeba u hloka ho ithuta haholoanyane ka li-laminate tse phahameng tsa Tg, ka kopo ikopanye le rona inthaneteng kapa u romelle lengolo-tsoibila hoem01@huihepcb.comRe tla thabela ho u sebeletsa.
