6 Layer ENIG Impedance Half Hole PCB
U ka Khetholla Half Hole joang Faeleng ea Hao ea Moqapi?
Half hole PCB e entsoe ka lebaka la sebopeho sa sesebelisoa le boto ea potoloho plug-in A masoba a le mong kapa a felletseng a sesebelisoa sa rowof a kenyelletsoa ka kotloloho ho kemiso ea lesoba la metalized halofo ho etsa bonnete ba hore halofo ea lihole tsa lisebelisoa li ka har'a boto le halofo li teng. ka ntle ho boto .Faele ea Gerber e lokela ho ba le tse latelang:
01.Lera la line(GTL le GBL)
Li-pads tsa halofo tsa lesoba li fumaneha holimo le tlase
02.Weld bare layer(GTS le GBS)
Weld barnier e bula sebakeng se halofo ea lesoba
03. Hole layer (TXT/DRL)
Sebaka sa lesoba la lesoba le leng le le leng la halofo
04.Mechanical/profile layer(GMU/GKO)
Profaele e lokela ho ba bohareng ba lesoba le leng le le leng la halofo
Mabapi le Metallized Half Hole PCB
The metallized halofo lesoba ke halofo lesoba pheletsong ea poleiti 'me e electroplated.Metallized semi-holes ke haholo-holo e sebelisetsoang ho hokahanya lipoleiti.Li sebelisoa haholo ho kopanya liboto tse peli tse hatisitsoeng tsa potoloho ka theknoloji ea moralo oa potoloho.Sistimi eohle e nka sebaka se tlase haholo ho feta sistimi ea PCB e sebelisang sehokelo sa phini ea mela.
Moralo Parameters Of Half Hole PCB
| Min.Hole Diameter | Bonyane pad | Sebaka se fokolang sa liphaephe | Sebaka se pakeng tsa fensetere le botala | Boholo bo fokolang ba borokho ba solder | Bonyane ba pin pitch |
| 500µm | 900µm | 250µm | 50µm-75µm | 100µm | 1150µm |
Li-PCB tsa Metallized Half Hole li Etsoa Joang?
Ntlha ea pele, li-electroplated through-holes li entsoe ka mathōko a PCS kapa SETS (li-unit tse nyenyane ka poleiti ea tlhahiso ea PNL), ebe mochine oa ho tsamaisa (mochine oa ho sila) o sebelisoa ho tlosa halofo ea likoti tsa electroplated, ho siea halofo e 'ngoe- masoba.
Kaha koporo e sebetsa ka thata 'me e ka 'na ea etsa hore sekhahla se robehe, lithipa tse khethehileng le lebelo le phahameng la poleiti lia hlokahala ho etsa hore bokaholimo ba marako a lesoba le mathōko a be boreleli.Seliba se seng le se seng se hlahlojoa ke setsi sa tlhahlobo ea lihlahisoa tse seng li felile.
Bophara bo fokolang ba masoba a halofo a ka hlahisoang ke Lipotoloho tsa HUIHE e tla ba 0.5 mm mme likoti tse halofo li arohane bonyane 0.5 mm.Haeba o hloka ho bula lesoba le lenyane la halofo ea lesoba, ka kopo ikopanye le basebeletsi ba rona ba litšebeletso tsa bareki ho buisana ka bokhoni ba tharollo.
Ha o etsa odara ea ho reka lipoleiti tsa halofo tsa lesoba tse nang le Lipotoloho tsa HUIHE, ka kopo buisana le lienjineri tsa tekheniki tsa HUIHE Circuit ho etsa bonnete ba hore o fumana tharollo e theko e boima ea tlhahiso.
Melemo ea rona Bakeng sa Half Hole PCB
1. Feme ea hae, sebaka sa fektheri 12000 square metres, thekiso e tobileng ea fektheri
2.20+ basebetsi ba mantlha ba tekheniki ba nang le boiphihlelo ba lilemo tse fetang 10, ba nang le boiphihlelo maemong a indasteri le boleng ba ts'ebetso.
3.Lisebelisoa tse tsoetseng pele: mochini o ikemetseng oa koporo / mohala oa electroplating, mochini oa ho pepeseha oa LDI / CCD le lisebelisoa tse ling ho hlahisa lihlahisoa tsa boleng bo holimo le tse tšepahalang.
