Molemo ka ho fetisisa 12 Layer ENIG FR4 Blind Vias PCB Moetsi le Feme |Lipotoloho tsa Huihe

12 Layer ENIG FR4 Blind Vias PCB

Tlhaloso e Khutšoanyane:

Likarolo: 12
Qetello e holimo: ENIG
Boitsebiso ba motheo: FR4
Lera la Kantle W/S: 7/4mil
Lera le ka hare W/S: 5/4mil
Botenya: 1.5mm
Min.bophara ba lesoba: 0.25mm

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Lisebelisoa tsa HDI PCB

Lisebelisoa tsa HDI PCB ke RCC, LDPE, FR4

RCC:Resin coated Copper ke e khuts'oane bakeng sa foil ea koporo e tlotsitsoeng ka resin.RCC e entsoe ka foil ea koporo le resin e nang le bokaholimo bo thata, ho hanyetsa mocheso le phekolo ea anti-oxidation (e sebelisoang ha botenya bo feta 4mil) . Lera la resin la RCC le na le ts'ebetso e tšoanang le ea FR4 sekhomaretsi lakane (prepreg).Ntle le moo, e lokela ho fihlela litlhoko tse nepahetseng tsa ts'ebetso ea laminate, joalo ka:

(1) Tšepahala e phahameng ea insulation le micro ka ho tšepahala;

(2) Mocheso o phahameng oa phetoho ea khalase (TG);

(3) Monyetla o tlase oa dielectric le ho monya metsi;

(4) E na le sekhomaretsi se phahameng le matla ho foil ea koporo;

(5) Ka mor'a ho phekola, botenya ba lesela la ho kenya letsoho bo tšoana

Ka nako e ts'oanang, hobane RCC ke mofuta o mocha oa sehlahisoa se se nang fiber ea khalase, e loketse phekolo ea laser le plasma etching, 'me e loketse poleiti e bobebe le e tšesaane ea mefuta e mengata.Ntle le moo, foil ea koporo e koahetsoeng ka resin e na le 12pm, 18pm e tšesaane ea koporo, e bonolo ho e sebetsa.